Mao-Feng Tseng
Advanced Packaging Process Engineer at Applied Materials
- Role
- Advanced Packaging Process Engineer - CTO Office at Applied Materials
- Location
- Sunnyvale, CA, US
- LinkedIn followers
- 500 followers
About Mao-Feng Tseng
Expertise in process development, advanced packaging, materials characterization and data analysis- Strong python-based problem solving skills: data analysis, lab automation, image processing and etc- Strong can-do spirit, clear self-driven learning trajectory and work behavior.
Experience
Advanced Packaging Process Engineer - CTO Office
May 2025 — Present · Sunnyvale, CA, US
Corporate CTO Office R&D engineer responsible for TSV process development in National Advanced Packaging Manufacturing Program (NAPMP).
Education
National Taiwan University
Bachelor of Science - BS, Materials Science and Engineering
2008 — 2012
Arizona State University
Doctor of Philosophy - PhD, Electrical Engineering
2018 — 2023
Georgia Institute of Technology
Master's degree, Computer Science
2030
National Taiwan University
Master of Science - MS, Materials Science and Engineering
2012 — 2015
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