Manu Yadav
- Role
- Microelectronics Packaging Engineer at Allegro MicroSystems
- Location
- Manchester, NH, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
About Manu Yadav
Dynamic PhD candidate seeking opportunities in Electronics Packaging and Reliability…
Experience
Microelectronics Packaging Engineer
Apr 2021 — Present
Education
Visvesvaraya Technological University
Bachelor’s Degree, Mechanical Engineering
2007 — 2012
Binghamton University
Doctor of Philosophy (Ph.D.), Industrial Engineering
Auburn University
Master’s Degree, Industrial Engineering
2014 — 2015
Skills
- Microsoft Word
- Gurobi
- Project Management
- Python
- Semiconductor Process Technology
- Industrial Engineering
- Sas E-Miner
- Data Analysis
- Computer-Aided Design (Cad)
- Design of Experiments
- Manufacturing
- Autocad
- Tableau
- Spc
- Ansys
- Microsoft Excel
- Visio
- C
- Solidworks
- Microsoft Office
- Lean Manufacturing
- Star-Ccm+
- Cad
- Scanning Electron Microscopy
- Scanning Electron Microscope
- R
- Powerpoint
- Engineering
- Matlab
- Sql
- Minitab
- Optical Microscopy
- Lean Six Sigma
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