Manish Ojha

Process Integration Engineer @NOISEFIGURE RESEARCH

Redmond, WA, US

Led the optimization of PVD, PECVD, and dry etch processes, resulting in a 10% increase in equipment uptime and a 15% reduction in processing time. Oversaw the installation and qualification of new PVD and DRIE systems, as well as the modification and upgrade of existing equipment.• Developed and implemented SOPs, and PM schedules, and optimized thin-film deposition and etching processes using DOE and SPC for quality control and process verification.• Optimized Ti diffusion barrier thickness using PVD for Cu interconnects, maintaining stability up to 350°C annealing without Ti-Cu intermetallic formation, achieving 2-3 Ω/cm sheet resistance.• Optimized the deposition of transparent conductive ITO films on glass substrates using PVD for optoelectrical devices, achieving target transparency and sheet resistance specifications based on customer requirements.• Develop innovative materials and processes for multilayer RDL flexible printed circuit integration, reducing backplane thickness by 50% significantly decreasing maximum trace strain during bending, and enhancing the mechanical reliability of wearable electronic products.• Lead innovation in semiconductor MEMS fabrication and integration, developing comprehensive process flows to achieve a 99% yield rate for sensor devices.• Utilize advanced metrology tools (AFM, XRD, FIB, SEM, optical microscope, reflectometry, profilometer) for critical functions, ensuring surface finish, film quality, and uniformity.

Grand Valley State University

Master of Science - MS, Mechanical Engineering

Old Dominion University

Doctor of Philosophy - PhD, Mechanical Engineering