Manaswini Sontineni

Hardware Applications Engineer @高通

San Diego, CA, US

Perform DC IR drop analysis, PI analysis and S-parameter extraction onPCB boards. Optimized PCB board to meet Z mask by selecting rightcapacitors. Also checked the traces for impedance and crosstalk.• Review PCB schematics and Layouts for customers before their tape outand suggest modifications.• Designed PCB layout (Altium Designer): Stack up considerations, Viaback drilling, High speed design rules and routing (PCIe, DDR).• Simulated for NEXT, FEXT on single and differential ended designs.• High speed board extraction for high speed and perform channelsimulation for high speed (PCIe, DDR). Checked for TDR, insertionloss, cross talk and Intra pair skew.• Performed integrated PCB and package EM analysis using ADS RF pro.• Review RF system level block diagram from SDR to Antennas to makesure they meet requirements.• Measure Tx and Rx parameters in lab using QC tools (QSPR, QRCT) andRF lab equipment for LTE, Sub-6 and mmWave.• Simulated E field for mmWave model and tested the device for EIRP ondifferent beam id’s by performing beamforming test.• Reproduce customer issues internally and work with them during RF boardbring up process.• Lead customer calls to provide RF HW customer support for QCmmWave modules and other chipsets, across regions by closely workingwith internal cross functional teams like SW, systems, design,mechanical teams.

The University of Texas at Dallas

Master’s Degree, Electrical Engineering (Telecommunications)

V R Siddhatha Engineering College

Bachelor’s Degree, Electrical and Electronics Engineering