Mahesh Paidpilli

Process Engineer | Semiconductor| Superconductor | Materials Engineer

Role
Td Module & Integration Yield Engineer at Intel
Location
Portland, OR, US
LinkedIn followers
500 followers
Information TechnologyView LinkedIn profile

About Mahesh Paidpilli

I graduated in August 2022, with my Ph.D.(Dr. Selva Research Group). I led the development of 4-micron thick film High-Temperature Superconductor Tapes (>50 m length) using an Advanced MOCVD in a single pass. In this work, the primary task was to build a robust A-MOCVD tool by resolving the engineering challenges of depositing 4-micron film from Reel to Reel. I correlated the tape\'s defect using statistical analysis of the processing parameters and inline 2D XRD feedback. Optimized the processing recipe and produced >50 m length uniform critical current HTS tapes ( 4x the performance of commercial superconducting tapes) for low and high-temperature applications. In addition, I worked on the preliminary tests to verify the ideas for constructing the next-generation Advanced MOCVD. I have good knowledge of subjects including Thin film of materials science, Semiconductor Processing, and Devices. I worked on several projects which includes: • Thin Film technology- high-temperature superconducting REBCO tape ( growth on an epitaxial layer of LMO(metallic)/ PRB/YSZ(non-metallic)/doublesided) via A-MOCVD. • Powder Technology- Synthesis, processing, and characterization of high strength aluminum alloys, bearing materials, and Tungsten heavy alloy via powder metallurgy route. • Lightweight metallic (Aluminum, Titanium) foams fabrication using stir casting and space holder technique. My core expertise lies in synthesis, processing, characterization, and mechanical testing of materials produced via Thin Film technology, powder, and liquid metallurgy. I am passionate about the research, the development of new materials, and looking for a career with a group of enthusiastic researchers who make future technology.

Experience

  1. Td Module & Integration Yield Engineer

    Intel

    Sep 2022 — Present · Hillsboro, OR, US

Education

  • University of Houston

    Doctor of Philosophy - PhD, Materials Science and Engineering, 3.76/4 GPA

    2018 — 2022

  • National Institute of Technology Raipur

    Bachelor’s Degree, Metallurgical Engineering, 9.23/10 CGPA

  • Indian Institute of Technology, Kanpur

    Master’s Degree, Material science and Engineering, 8/10 CGPA

  • Krishna Public School

    High School, Science

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Mahesh Paidpilli — Td Module & Integration Yield Engineer at Intel in Portland, OR, US | Unifers