Mahesh Hardikar
- Role
- Ic Packaging Engineer at Apple
- Location
- Mountain View, CA, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
Experience
Ic Packaging Engineer
Apr 2019 — Present
Skills
- Product Engineering
- Semiconductors
- Finite Element Analysis
- Odm Management
- Root Cause Analysis
- Microprocessors
- Arm
- Thermal Analysis
- Accelerated Life Testing
- Program Management
- Gd&T
- Characterization
- Supplier Quality Management
- Engineering
- Ic
- Ematrix
- Supplier Development
- Electronics Packaging
- Cross-Functional Team Leadership
- Supplier Quality
- Design for Manufacturing
- Vendor Management
- Design of Experiments
- Materials Management
- Flotherm
- Rapid Prototyping
- Injection Molding
- Soc
- 3d Modeling
- Mechanical Engineering
- Failure Analysis
- Labview
- Asic
- Reliability Engineering
- Test Automation
- Contract Manufacturing
- Green Belt
- 3d Printing
- Board Bring-Up
- Interconnect
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