Max Ghaleni
Advanced Packaging | Heterogenous Integration | Power Delivery | Ex-Micron | Ph.D.
- Role
- Advanced Packaging Engineer Technical Lead-substrate Definition Integration at Intel
- Location
- Phoenix, AZ, US
- LinkedIn followers
- 500 followers
About Max Ghaleni
Driving Heterogeneous Integration in Advanced Packaging
Experience
Advanced Packaging Engineer Technical Lead-substrate Definition Integration
Jun 2025 — Present · Phoenix, AZ, US
Owning pathfinding technical activities to scale Intel’s EMIB-T advanced packaging solutions for future customers and applications. Driving power delivery and efficiency improvements to meet the rising demands of advanced nodes and next-generation chip packaging. Designing test vehicles (TVs) with substrate suppliers and OSATs to evaluate new materials, technologies, and configurations for manufacturable solutions. Defining substrate architectures, building blocks, process flows, design rules, and material requirements for future substrate technologies. Owning Substrate Target Specs (STS) and Manufacturing Target Specs (MTS) for EMIB-T technology pathfinding. Defining program FMEA and TV strategy in the pathfinding stage for EMIB-T and advanced power delivery solutions.
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