Mahadev Harugeri
Sr. IC Package Design Engineer
- Role
- Sr Advance Ic Package Design Engineer (Client - Amd) at Tata Consultancy Services
- Location
- Bengaluru, KA, IN
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
About Mahadev Harugeri
I have 8+ Years experience in IC Package Design. working on FlipChip High speed design…
Experience
Sr Advance Ic Package Design Engineer (Client - Amd)
Jul 2024 — Present · IN
IC Packaging, Interposer Designs, Flip Chip 2D & 2.5D, UCIe, FCBGA, FCCSP, Allegro Skill Programming.
Education
KLE Institute of Technology, HUBLI
Bachelor of Engineering
2013 — 2016
KLE Polytechnic Mahalingpur
Diploma
2010 — 2013
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