Mahadev Harugeri

Sr. IC Package Design Engineer

Role
Sr Advance Ic Package Design Engineer (Client - Amd) at Tata Consultancy Services
Location
Bengaluru, KA, IN
LinkedIn followers
500 followers

About Mahadev Harugeri

I have 8+ Years experience in IC Package Design. working on FlipChip High speed design…

Experience

  1. Sr Advance Ic Package Design Engineer (Client - Amd)

    Tata Consultancy Services

    Jul 2024 — Present · IN

    IC Packaging, Interposer Designs, Flip Chip 2D & 2.5D, UCIe, FCBGA, FCCSP, Allegro Skill Programming.

Education

  • KLE Institute of Technology, HUBLI

    Bachelor of Engineering

    2013 — 2016

  • KLE Polytechnic Mahalingpur

    Diploma

    2010 — 2013

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Mahadev Harugeri — Sr Advance Ic Package Design Engineer (Client - Amd) at Tata Consultancy Services in Bengaluru, KA, IN | Unifers