Maggie Hu
IC Packaging Engineer at Apple
- Role
- Ic Packaging Engineer at Apple
- Location
- Santa Clara, CA, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
About Maggie Hu
IC Package Integration Engineer with 11 years of experience in advanced semiconductor…
Experience
Ic Packaging Engineer
Jun 2015 — Present
Education
Tsinghua University
Bachelor
2006 — 2010
2012 Dielectric EAP training school - Neuchatel, Switzerland
Electroactive Polymers
2012 — 2012
Skills
- Microscopy
- Tem
- Afm
- Ftir
- Uv/Vis
- Lcr
- Characterization
- Materials Science
- Labview
- Gpc
- Matlab
- Nanotechnology
- Dynamic Mechanical Analysis
- Scanning Electron Microscopy
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