Muhammad Abdullah
3DHI Advanced Semiconductor Packaging at GlobalFoundries
- Role
- Principal Engineer - Advanced Packaging Integration & Yield at GlobalFoundries
- Location
- Austin, TX, US
- LinkedIn followers
- 500 followers
About Muhammad Abdullah
Experienced semiconductor professional with a strong background in 3DHI and advanced packaging technologies. I specialize in die-to-wafer D2W bonding, W2W bonding, and full-flow integration of short-loop test vehicles—ranging from design and tape-out through BEOL processing, bonding, and post-bond characterization.Currently serving as a Technical Lead for Advanced Packaging R&D, I drive both technical integration and external program management, including vendor collaborations, budgeting, and roadmap execution. Previously, as a Principal Engineer in 3DHI, I led process integration and die preparation efforts across multiple bonding schemes, and managed tool qualification and yield improvement projects.Passionate about enabling next generation chiplet architectures through innovation at the intersection of materials, process, and system integration
Experience
Principal Engineer - Advanced Packaging Integration & Yield
Feb 2026 — Present
Driving advanced packaging initiatives in high-volume manufacturing fab through data-driven process optimization and cross-site collaboration.
Education
Bahauddin Zakariya University
Bachelor's degree, Organic and Biochemistry
2010 — 2014
University of Massachusetts Amherst
PhD, Semiconducting Materials Chemistry
University of Massachusetts Amherst
Master's degree, Chemistry
Lahore University of Management Sciences
Master's degree, Chemistry
2014 — 2016
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