Lingesh Maris
TSVr Dry Etch Engineer at Intel Corporation
- Role
- Module Development Engineer at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
Experience
Module Development Engineer
Apr 2024 — Present · Hillsboro, OR, US
Responsible for dry etch process development and sustaining in the TSVr (Through Silicon Via reveal) module, part of Intel’s Front-End of Back-End (FEoBE) manufacturing, supporting Foveros 3D packaging technology.• Lead sustaining during back-end of the week; managing tool performance, process health, factory automation and high-volume wafer output to achieve weekly target.• Effectively led cross-factory technician teams, optimizing resource allocation and task prioritization to ensure uninterrupted production even with minimal manpower.• Coordinate with tool vendors for Continuous Improvement Projects (CIP) and field service engineering (FSE) support, efficiently prioritizing maintenance tasks and providing necessary resources on time to ensure quick and effective tool recovery.• Ensure that all activities performed are in compliance with factory safety protocols; serve as a certified hazardous energy control (CoHe) inspector to maintain a safe workplace.• Provide training and mentorship for technicians and college interns on process operations, troubleshooting, and safety protocols.
Education
UC San Diego
Master of Science - MS, Nanoengineering
Umeå University
Exchange Student, Physics
SRM IST Chennai
Bachelor of Technology - BTech, Nanotechnology
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