Cheng-Yi Lin

About Cheng-Yi Lin

I joined IBM as a Product Characterization and Yield Management Engineer in 2015. During the 14nm technology development and manufacture, I gained strength in IBM product characterization, data analytics/visualization, data mining, interfacing with the database, and root cause understanding. Prior to coming to IBM, I studied in the Electrical Engineering department at the University of California, Los Angeles (UCLA), focusing on solid-state electronics and circuit design. Through projects of transistor design, I acquired in-depth and extensive knowledge in TCAD simulation. While researching at UCLA, I developed a portable readout circuit system for In2O3/RGO gas sensors. I also learned to implement a pipelined analog-to-digital converter (ADC) and Fast Fourier transform (FFT) processors from course projects. Before joining UCLA, I conducted research on semiconductor materials (InN) for the applications of ion-sensitive FETs and Pt-catalyzed gas sensors at National Tsing-Hua University. In 2008 summer, I worked in the Process Integration Engineering department as a summer intern at Taiwan Semiconductor Manufacturing Company (TSMC).In short, my core strength is in (1) Data engineering, analytics, mining;(2) Product yield characterization and device physics;(3) Python, SAS, SQL, and Dash programming.

Experience

1. Power Product Characterization, Advisory Engineer

   IBM

   Jun 2019 — Present · New York, NY, US

   Feb. 2025 - Dec. 2025: Init Design for Test (DFT) Development- Prototyped a Cust.pak tooling for a holistic approach to customize chip-specific information, such as ring repairs and attributes- Worked on the pattern generation through traces for the Part-Number-Programs (PNP) application to test microprocessor chips. Built patterns via Jenkins’ Continuous Integration (CI) build- Constructed the Engineering Manufacturing Test Specifications for the Digital Thermal Sensors (DTS) in Excel format and implemented the corresponding YAML files for the Teradyne IG-XL application.Jul. 2022 - Jul. 2023: Developed a Kerf-WFT dashboard providing a web yield tracking system. Integrated the inline FEOL/BEOL/Functional data with Wafer Final Test data. It automated the complex data computation, provided flexible diagnosis, and enhanced efficiency by an average of 12.5X.Jun. 2019 - Dec. 2021- Led the characterization of the 7nm P10 WFT to identify yield detractors and quantify the impact on yield due to issues such as M3 Cu bridging, missing vias, and IOBIST problems- Developed and optimized Python scripts in Jupyter Notebook, resulting in a 5X speed improvement when refreshing status. Conducted multivariate analysis using the JMP tool.

Education

• National Tsing Hua University

  Bachelor's Degree, Power Mechanical Engineering

  2003 — 2007

• UCLA

  Master's Degree, Electrical Engineering

• National Tsing Hua University

  Master's Degree, Electrical and Electronics Engineering

  2007 — 2009

Skills

• Python
• Characterization
• Comsol
• Cadence Virtuoso
• Sensors
• Comsol Multiphysics
• C
• Signal Processing
• Mathematica
• Tsuprem-4
• Simulink
• Physics
• Nanotechnology
• Tcad
• Photolithography
• Experimentation
• Labview
• Keithley 4200-Scs Measurement
• Sentaurus Device/Process
• C++
• Medici
• Matlab
• Spice
• Simulations
• Device Physics & Fabrication
• Electrical Engineering