Liang Yin
- Role
- Electronic Packaging Engineer at Ge Research
- Location
- Schenectady, NY, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
About Liang Yin
Experienced R&D engineer working on electronics prototyping, qualification and…
Experience
Electronic Packaging Engineer
Sep 2012 — Present
Power packaging of SiC semiconductor devices for industrial power applications, including solar, wind and avionics- Flexible hybrid electronics for wearable healthcare device, and industrial asset monitoring- High temp. packaging of SiC-based sensor electronics for geothermal, combustion and O&G applications.
Skills
- Thin Films
- Minitab
- Semiconductors
- Design of Experiments
- Engineering Management
- Simulations
- Labview
- Process Engineering
- Materials
- Reliability
- Matlab
- Characterization
- Powder X-Ray Diffraction
- Spc
- Finite Element Analysis
- Materials Science
- Sensors
- Failure Analysis
- Scanning Electron Microscopy
- Research and Development (R&D)
- Mems
- Electronics
- Electronics Packaging
- Reliability Engineering
- Jmp
- R&D
- Design for Manufacturing
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