Lesley Polka
Principal Engineer at Intel Corporation
- Role
- Electrical Engineer at Intel
- Location
- Chandler, AZ, US
- LinkedIn followers
- 500 followers
Experience
Electrical Engineer
Nov 1994 — Present
Focus Areas: Electrical Program management for electronic package design, Technology Development for Electronic Packaging & Interconnects (wirebond, flipchip, ceramic, organic, BGA, LGA, PGA, sockets, boards); High-Speed Signaling & Signal Integrity; System, Sub-System & Bus Architectures (server, desktop, mobile, RF/wireless, DDRx, PCI, Serdes)Additional Professional Information: Four U.S. patents issued in the area of electronic packaging;~20 papers / conference publications in the areas of electronic packaging and computational electromagnetics; guest / adjunct instructor experience teaching engineering courses at Arizona State University; Senior member active in the Phoenix Section; 2016 Society of Women Engineers (SWE) Prism Award Winner; 2017 Region 6 Women in Engineering Award Winner.
Education
Arizona State University
B.S.E., M.S., Ph.D.
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