Labdhi Shah
Advanced Packaging Engineer
- Role
- Advanced Packaging Process Engineer at Micron Technology
- Location
- Austin, TX, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
Experience
Advanced Packaging Process Engineer
Jun 2025 — Present · Boise, ID, US
Education
Faculty of Technology and Engineering, The Maharaja Sayajirao University of Baroda
Chemical Engineering , Chemical Engineering
2014 — 2018
University of Florida
Master of Science - MS, Chemical Engineering
2020 — 2022
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