Kwangmo Lim

Role: 3d Glass Solutions, Inc
Location: San Jose, CA, US
LinkedIn followers: 500 followers

OtherView LinkedIn profile

About Kwangmo Lim

Semiconductor packaging and substrate development (new architecture, process, material…

Experience

3d Glass Solutions, Inc
Present

Skills

Optics
R&D
Fmea
Project Management
Substrates
Failure Analysis
Semiconductor Industry
Soc
Research and Development (R&D)
Cross-Functional Team Leadership
Packaging
Ic
Yield
Engineering Management
Electronics
Team Leadership
Intel
Semiconductor Process
Design of Experiments
Process Integration
Jmp
Lithography
Semiconductors
Leadership
Photolithography
Spc

Contact information

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Work email
k••••••••@3dgsinc.com
Personal email
•••••@•••••.com
Direct dial
+14•••••••52

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Current company

3d Glass Solutions, Inc

Appliances; Electrical; and Electronics Manufacturing · 66 employees · Albuquerque, New Mexico, United States

3D Glass Solutions, Inc.(3DGS) is a private late-stage high-tech manufacturing business headquartered in Albuquerque, New Mexico. 3DGS’ main operations are focused on the fabrication of electronic system and devices using photo-definable glass-ceramics. 3DGS manufactures a wide variety of glass-based system-in-package (SiP) devices and components using its patented low-loss photosensitive APEX® Glass technology for applications in radio-frequency (RF) electronics, photonics, automotive radar, integrated circuit (IC) electronics, medical, aerospace, defense, wireless infrastructure, mobile handset, and Internet of Things (IOT) industries. 3DGS has created foundational patent positions related to all photo-sensitive glass-ceramic materials and devices. 3DGS owns the fundamental intellectual property (IP) for all four positions (materials, design, systems, & manufacturing) related to glass-ceramic devices for the electronics packaging industry. 3DGS leverages its unique product solutions providing device manufacturing and systems integration services for a number of standard and custom products. We provide our customers complete glass-enabled systems integration services. Our aim is to provide our customers with an integrative solution in RF electronics and IC packaging that allows them to integrate more components onto a single platform while decreasing overall manufacturing costs.

3dgsinc.com

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