Kulanthaivelu P

Experience

1. Ic Package Designer

   Qualcomm

   Oct 2022 — Present · Bengaluru, IN

   As an IC package designer at Qualcomm, I work on various package design activities such as TV,FCBGA,DOE(design of Experiment)and MEP (Moulded Embedded Package),POP(package on Package) and Interposer designs.My responsibilities include DIE & BGA creation stackup updation,Constraint setup,Embedded placement, BGA assignment,die fanout, BGA fanout,power segmentation,signal planning and routing,degassing,metal balancing,film setup,ODB genration and final documentation.•Experience in working on ETS,MSAP,SAP layer technologies and number of Stacking via as well as Staggered via concepts.•Have worked with LPDDR5,LPDDR6.•Have worked with various interface signals like CSI,DSI,USSB,Pcie,GNSS,PAM,Qlink,DDR•Experience in embedded component placement.•Experience in DSC,LSC & DTC component placement.•Experience in handling AUTO CAD for final documentation like BL90 and DS90 creation.•Experience in handling high complex package designs.•Implementation SI & PI requirements to the layout.•Experience in Valor for DFM checks.

Education

• Adithya Institute of Technology

  Bachelor of Engineering - BE

  2015 — 2018