Krishna Theja
IC Packaging R&D Engineer at Intel Corporation
- Role
- Ic Packaging R & d Engineer at Intel
- Location
- Bengaluru, KA, IN
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
About Krishna Theja
Experienced IC Package Designer & Senior Printed Circuit Board with a demonstrated…
Experience
Ic Packaging R & d Engineer
Feb 2021 — Present · Bengaluru, IN
Education
Anna University
Bachelor of Engineering - BE
Skills
- Hardware Architecture
- Electronics
- Pcb Design
- Rf
- Debugging
- Analog
- Product Development
- Embedded Systems
- Manufacturing
- Testing
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