Kong Weng Lee

About Kong Weng Lee

1) Assembly process and packaging content expert in low cost packaging solution for high power edge emitting laser diode.(TO-can, AlN Chip-on-Submount, Plastic Premolded Leadframe packages, Compact Laser Integrated Photonic Module with driver and optics components in leadframe, flex PCB and silicon WLP optical packages)(2) Packaging technology development for high power VCSEL multi-array devices for 3D Sensing(3) Working closely with offshore contract manufacturer in low cost high volume packaging solution from design and development to full qualification for Gesture Recognition, Time of Flight and 3D sensing in gaming, automotive, mobile and consumer applications.(4) Developed and transferred thick Aluminum wire bonding process for high power industrial laser module to contract manufacturer in China.(5) Managed offshore wire bond/flip chip assembly, bumping and substrate suppliers and work closely with internal & external cross-functional teams on yield and excursion, assembly process improvement, quality and reliability assessment.(6) RFIC new package startup for ceramic and molded leadframe packages, process development of AuSn/AuSi eutectic die bonding and Au pad wire bonding for high power open cavity packages.(7) 65nm low K / Copper Wafer Technology qualification in flip chip and wire bond BGA Packages.(8) Package and Process development for Molded Leadless Package (MLP/ QFN) with NiPdAu pre-plated leadframe.(9) LED Package Technology Development fulfilling lead free requirements and RoHS compliant. Eutectic AuSn bonding process technology development for ultra low junction and high brightness device.(10) Successfully transferred and startup the C4 (flip chip) epoxy module in Intel Penang and also completed the epoxy cure optimization project for OLGA package.(11) Successfully transferred and startup the Wafer backgrinding modules for thin packages.Specialties: Semiconductor Backend Assembly Process and Packaging Technology Development.

Experience

1. Senior Principal Packaging Technical Lead

   Lumentum

   Feb 2010 — Present

   1) Laser Packaging Design and Assembly Technology Development for high power Edge emitter and VCSEL multi-array laser devices in ToF and Structure Light depth sensing2) Module and packaging design for 3D Sensing in gaming, automotive, mobile and consumer applications 3) Thick Aluminum Wedge Wire Bonding for High Power Laser Modules

Education

• University of Cambridge

  Ph.D., Materials Science and Metallurgy

• University Science of Malaysia

  Bachelor of Applied Science (B.A.Sc.), Master of Science (Msc.)

Skills

• Process Simulation
• Project Planning
• Ausn Soldering
• Silicon Photonics
• Microelectronics
• Ic
• 3d Sensing Package
• Led Packaging
• Lean Six Sigma
• Wafer Level Packaging
• Flip Chip
• Six Sigma
• Minitab
• 8d Problem Solving
• Package and Process Development
• Electronics Packaging
• Ceramic Packaging
• Lean Manufacturing
• Photonics
• Heavy Wire Bonding
• Project Management
• Solidworks
• Spc
• Continuous Improvement
• Materials
• Yield
• Materials Science
• Rf
• Failure Analysis
• Semiconductor Industry
• Semiconductors
• Product Development
• R&D
• Engineering Management
• Wire Bonding
• Reliability
• Fmea
• Gold and Aluminum Wire Bonding
• Cross-Functional Team Leadership
• High Power Laser Packaging