Kevin M.
Lead Field Service Engineer, Tokyo Electron America
- Role
- Lead Field Engineer at Tokyo Electron US
- Location
- Boise, ID, US
- LinkedIn followers
- 500 followers
About Kevin M.
Employed in service and management positions much of my career, I have developed the understanding and the tools needed to achieve corporate goals. Customer support roles have taught me the importance of customer satisfaction and retention. Working in a highly technical arena, I possess a solid structure of mechanical, electrical and process engineering skills. My experience includes long term customer support roles at Micron, Samsung, Qimonda, Hewlett Packard, Intel, AMD, National semiconductor, IDT, Fujitsu, Hynix, Sharp.Equipment/Process Specialties: High-k ALD deposition, Temporary/Permanent wafer Bonding and De-Bonding, Diffusion (ASM, TEL, Kokusai) CVD (Altus, Sequel, Sabre and Speed) PVD, PECVD experience.
Experience
Lead Field Engineer
May 2005 — Present
Assisted in over 150 TEL tool installs across the US. The majority of my TEL experience is in Diffusion, I am currently working on TEL ALD tools. Trained and certified to work on the following: Synapse S fusion bonder, Synapse V temporary bonder, Synapse Z de-bonder, TELIndy B, TELIndy Plus, TEL 303i, TEL SPA, TEL 8se, TEL 8s.
Education
Foothill College
Associate of Arts and Sciences (AAS), Electronics, Chemistry
1981 — 1982
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