Katie Yu
Package Innovation Senior Director at NXP
- Role
- Package Innovation Secure Connected Edge, Package Design Center at NXP Semiconductors
- Location
- Austin, TX, US
- LinkedIn followers
- 500 followers
Experience
Package Innovation Secure Connected Edge, Package Design Center
Oct 2024 — Present · Austin, TX, US
Manage packaging development for secure connected edge (consumer/industrial) including package technology qualification and technology roadmap needs including edge AI. Manage global semiconductor package design center for new products across all NXP businesses supporting $13B revenue. Advanced packaging CHIPS Act R&D needs, chair of MAPT materials, substrates and supply chain team.
Education
University of Michigan
Bachelor's degree, Engineering Physics
Cornell University
Doctor of Philosophy (PhD), Materials Science
1991 — 1997
Skills
- Mems
- Manufacturing
- Ic
- Semiconductors
- Soc
- Semiconductor Industry
- Process Improvement
- Jmp
- Design for Manufacturing
- Asic
- Cross-Functional Team Leadership
- Strategy
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