Joshua Westbrook
Packaging Design Engineer @ Transpak | Mechanical Engineering
- Role
- Packaging Design Engineer at TransPak
- Location
- Portland, OR, US
- LinkedIn followers
- 500 followers
About Joshua Westbrook
Intel Corporation benefits from contributions to advanced microelectronic packaging research and development. Leveraging a Bachelor\'s Degree in Mechanical Engineering from the University of Colorado Boulder, supported process optimization, troubleshooting, and data analysis initiatives that align with cutting-edge industry demands. Collaborated on complex engineering challenges to enhance innovation in packaging solutions. EV Group experience reinforced technical acumen in lean processes and work instruction development, while fostering a strong foundation in AutoCAD and quality assurance. Passionate about driving impactful contributions to mechanical design and manufacturing. Dedicated to solving engineering challenges through strategic thinking and innovation.
Experience
Packaging Design Engineer
Aug 2025 — Present
Education
University of Colorado Boulder
Bachelor's Degree, Mechanical Engineering
2011 — 2014
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