John Manderfield
- Role
- Innovation and Design Fellow at Altium Packaging
- Location
- Marietta, GA, US
- LinkedIn followers
- 500 followers
Research & DevelopmentView LinkedIn profile
Experience
Innovation and Design Fellow
Jan 2022 — Present
Skills
- Business Process Improvement
- Plastics
- Product Design
- Process Improvement
- Packaging
- Unigraphics
- Design for Manufacturing
- Manufacturing
- Cross-Functional Team Leadership
- Product Development
- Creative Direction
- Rapid Prototyping
- Cad
- Continuous Improvement
- Computer-Aided Design (Cad)
- Industrial Design
- Siemens Nx
- Lean Manufacturing
- Product Lifecycle Management
- Nx Unigraphics
- Engineering
- Teamcenter
- Packaging Design
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