John Boston

Managing Director @Custom Interconnect

CIL is the UK\'s largest semiconductor packaging facility and also has 8 SMT lines and associated inspection and test equipment based in two facilities totalling ft. A multi-award winning company, it has a proven track record in the production of high reliability electronics to a number of Market Sectors, including Automotive BEV & PHEV, Oil & Gas, Defence, Homeland Security, Instrumentation, Medical and Communications electronics. Area\'s of particular key process know-how centres on Semiconductor packaging including wafer dicing, die bonding, wire bonding and packaging SiC & GaN packaging using Silver Sintering techniques to thermal substrates. High Temperature Electronics (>195degC operating) for the Oil & Gas Industry SiC & GaN based technology for BMW, McLaren, JLR and many other OEM\'s RF / Microwave PCB assembly and RF MMIC packaging for communications equipmentSemiconductor packaging CIL has built up a reputation in leading edge packaging technologies, which provide its customers with higher levels of miniaturisation. CIL is currently the largest semiconductor packaging facility in the UK. Technologies include Wafer dicing and sort, Aluminium Wedge and Gold Ball wire bonding, die attach / bonding and packaging of custom sensors and assemblies. Automotive SiC & GaN devices using Silver Sinter die attach, heavy gauge wire bonding or sintered copper clip, and full SiC power module design, prototyping and production assembly. Electronics Manufacturing ServicesCIL houses an EMS division comprising of high capability SMT and Conventional electronics production and test facility. With 8 SMT Lines and a comprehensive assembly team trained to IPC610 level 3 that can assemble PCBA\'s and conduct all of the product assembly and testing stages required to ISO9001, ISO13485 and AS9100D standards.