Johanna Stensaas
Microelectronics Packaging Engineer @Intel
Portland, OR, US
EMAILS
MOBILE NUMBERS
+91 *********19
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WORK HISTORY
Apr 2024 — Present
Microelectronics Packaging Engineer @Intel
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Hillsboro, OR, US
Microelectronic Packaging Engineer within the Laser Singulation Module at Intel
EDUCATION
2019 — 2020
University of Oregon
Master of Science - MS
2015 — 2019
Willamette University
Bachelor's degree
ABOUT JOHANNA STENSAAS
Packaging R&D Engineer
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