Jing Wang

About Jing Wang

5 years of research experience and 7 years of working experience in reliability of IC packaging and PCB assembly• Good understanding of advanced packaging technologies (2.5D/3D packaging), assembly processes (Flip-chip, die attach, Wire Bonding, RDL and TSV fabrication), IC packaging materials (underfill, solder, molding compound, die attach adhesive) and Surface Mount Technology (SMT)• Familiar with reliability testing standards (JEDEC, IEC, IPC, AEC) and IC packaging qualification requirement• Familiar with reliability testing methods such as Mechanical Stress Testing (Drop, Shock, Tumble, Vibration, Bend, Shear), and Accelerated Environmental Stress Testing (TC, THB, THS, HTSL, Autoclave, HAST), Accelerated Lifetime Simulation Test (HTOL, ELFR), Electrical Verification Test (ESD, Latch-up), Package Assembly Integrity Test and HALT/HASS.• Knowledgeable in 2.5D/3D IC integration with TSV, WLCSP, Embedded Chip Package, Fan-Out Package, BGA, QFN, SiP, CLGA, OLGA, CLCC.• Rich hands-on experience in thermal testing, material characterization, reliability testing and failure analysis tools, such as DMA, TMA, TGA, MTS, DIC, X-ray, SEM, Optical Microscopy, C-SAM, Fatigue tester, Thermal Imaging (IR camera), Cross-sectioning, Three/Four Point Bending, Environmental chambers (TC, THS, uHAST, Autoclave), Wind tunnel, Data Acquisation Unit.• Strong background in solid mechanics and fracture mechanics• Skilled at thermal, thermo-mechanical, dynamics (drop/shock), fatigue, fracture mechanics, moisture diffusion, hygroscopic swelling and multiphysics FEA simulation with ANSYS Mechanical APDL, Workbench and LS-Dyna• Proficient in using numerical modeling tools (FEA/CFD) for early stage risk assessment (Chip package interaction, Warpage/Stress/Delamination, Solder joint reliability life prediction, Thermal Analysis, Moisture Diffusion) and product design optimization• Six Sigma Green Belt certified. Knowledge of Statistical analysis and Lean Six Sigma tools including Design of experiment (DOE), Gage R&R, Confidence and Tolerance intervals, ANOVA, Statistical Process Control (SPC), Hypothesis testing, FMEA and QFD

Experience

1. Reliability Engineer

   Apple

   Jan 2023 — Present

   Airpods and Home Reliability

Education

• Binghamton University

  Doctor of Philosophy - PhD, Mechanical Engineering

  2014 — 2018

• University of Science and Technology Beijing

  Master's degree, Metallurgical Engineering

  2011 — 2013

• University of Science and Technology Beijing

  Bachelor's degree, Metallurgical Engineering

  2007 — 2011

Skills

• Jedec
• Fea
• Abaqus
• Java
• Tma
• Optical Profiler
• Digital Image Correlation
• Dma
• Solder Life Prediction
• Icepak
• Tga
• Failure Analysis
• Mts
• Matlab
• Computational Modeling
• Wire Bonder
• Python
• Sem
• Thermal Characterization
• Statistical Data Analysis
• Thermal Cycling Chamber
• C-Sam
• X-Ray Spectroscopy
• Cfd
• Ansys
• Confocal Laser Scanning Microscope
• Reliability Test
• 3d Printing
• Solidworks
• Temperature-Humidity Chamber
• Electronic Packaging
• Four Point Bending
• Strength of Materials
• Microelectronics
• Fracture Mechanics
• Semiconductors
• Doe
• Solid Mechanics
• Lean Six Sigma
• Cross-Section