Jin Chen
IC Package Engineer at Broadcom
- Role
- Senior Ic Package Design Engineer at Broadcom
- Location
- Sunnyvale, CA, US
- LinkedIn followers
- 500 followers
About Jin Chen
I am currently working on the design and development of innovative IC packaging solutions that combines the best of cost and performance.I have direct experience in collaborating with internal business units and offsite assemblies in new package and device development efforts-Lead packaging development through feasibility, development/design, qualification, and production phases-Codesign with silicon design team in strategic floor planning to achieve the optimal packaging solution
Experience
Senior Ic Package Design Engineer
Nov 2024 — Present · San Jose, CA, US
Education
The University of Texas at Dallas
Master of Science - MS, Mechanical Engineering
2019 — 2021
The University of Texas at Dallas
Bachelor of Science - BS, Mechanical Engineering
2016 — 2020
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