Jesse Jones
Advanced Packaging Technologist & Module Development Engineering Manager | Heterogeneous Integration | HDI Organic/Glass Substrates | Supply Chain | RF Module and Antenna Development
- Role
- Advanced Packaging Technologist Packaging Module Development Engineering Manager at Intel
- Location
- Phoenix, AZ, US
- LinkedIn followers
- 500 followers
About Jesse Jones
An intensely curious engineer with a drive to work on cool technologies…
Experience
Advanced Packaging Technologist Packaging Module Development Engineering Manager
Feb 2022 — Present
Pioneered industry-first technolgies for glass core substrates, driving technology creation and vendor selection to enhance product reliability- Mentored new engineers, fostering growth and development into outstanding contributors- Integration segment leader for development and definition of high-density interconnect product technology- Developed glass-capable EMIB die bonder fleet with industry-leading accuracy.
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