Jean-Francois Vidon

Senior Director, Engineering @高通

San Diego, CA, US
EMAILS
j••••••••@qualcomm.com
MOBILE NUMBERS
+18•••••••62

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WORK HISTORY

Nov 2020 — Present

Senior Director, Engineering @高通

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Responsible of CPU PPA (Performance, Power and Area) for Qualcomm CPU Subsystems. • Leading Frontend implementation team for premium tier mobile and other Qualcomm SoCs • Driving Power analysis, modeling and optimization on Qualcomm CPUSS. • Started and grew teams of various disciplines such as frontend implementation (synthesis, constraint, upf/cpf), power analysis and modeling, DFT across various geographical locations

EDUCATION

1994 — 1996

IUT B Lyon

Diplome de Technicien Superieur, Electronics

N/A

INP Phelma - Enserg

Diplome d'Ingnieur, Architecture of Digital systems of Information Processing

SKILLS

Physical DesignProcessorsVerilogLow-Power DesignSpyglassTclClock Tree SynthesisAhbSynopsys ToolsVhdlNcsimSocEdaAnalogMixed SignalPrimetimeRtl CodingPower ManagementStatic Timing AnalysisArmTiming ClosureCmosEquivalence CheckingLow PowerIntegrated Circuit DesignSemiconductorsIntegrated Circuits (Ic)DftLogic SynthesisAsicAxiRfRtl DesignAmba AhbDigital DesignFormal VerificationIc

ABOUT JEAN-FRANCOIS VIDON

20+ years’ experience in IC design of wireless SOC ( Modem, multimedia…

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