Jaya Krishna M.
Module Process Engineer at Intel | Specializing in Advanced Packaging & Die Prep Process | Expertise in Dry Etch & Process Optimization | Data-Driven Problem Solver
- Role
- Advanced Packaging Module Engineer - Die Prep at Intel
- Location
- Albuquerque, NM, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
About Jaya Krishna M.
I am a skilled process engineer with a focus on Advanced Packaging and Dry Etch…
Experience
Advanced Packaging Module Engineer - Die Prep
Dec 2024 — Present · Rio Rancho, NM, US
Education
JNTUH College of Engineering Hyderabad
Bachelor of Technology (BTech)
University at Buffalo
Masters in Chemical Engineering
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