Jay Patel
Embedded Technical Lead (Usa Onsite) @VOLANSYS (An ACL Digital Company)
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WORK HISTORY
Embedded Technical Lead (Usa Onsite) @VOLANSYS (An ACL Digital Company)
Oklahoma City, OK, US
Embedded hardware owner for \"AirBoxOne\" product at Drov Technologies, leading BLE TPMS design, PCB revisions, lab setup, and end-to-end system level debugging for field failures, including RMA analysis and next-generation design improvements.
EDUCATION
Vishwakarma Govt. Engg. College, Chandkheda, Gandhinagar
Bachelor of Engineering (B.E.)
Vishwa Vidhyalaya, Asarwa, Nr.Civil Hospital, Ahmedabad
Study Secondary and Higher Secondary School Education
Sarvoday Vidhya Mandir, Bapunagar, Ahmedabad
Study till Primary School Education
SKILLS
ABOUT JAY PATEL
Embedded Hardware Leader with 11+ years of experience driving product design, development, and delivery across Automotive, Consumer, Industrial, Medical, IoT, and Edge-AI domains. Skilled at translating complex requirements into value-driven, cost-effective, and user-centric embedded products from concept to production and field deployment. Recognized for leading cross-functional teams to consistently deliver reliable, scalable, and next-generation hardware solutions.Proven expertise in end-to-end hardware development and system architecture. Experienced in requirements finalization, feasibility studies, competitive benchmarking, schematic and PCB design, board bring-up, EDVT validation, design reviews, pre-compliance certification, and production handover. Adept at aligning technical execution with business goals and ensuring engineering excellence throughout the product lifecycle.Technically versatile across digital, analog, mixed-signal, high-speed, RF, and sensor-based designs. Hands-on experience with MCU/MPU/SoC platforms, low-power battery-operated systems, multi-RF coexistence, EMI/EMC-robust design, and performance-driven optimization. Brings deep knowledge of regulatory standards (FCC, IC, CE, NOM/IFETEL, RCM) and comprehensive validation, including HALT/HASS, 4-corner testing, mechanical shock, vibration, and electrical safety.Strong operational and manufacturing leadership. Experienced in working with supply-chain and production teams to resolve manufacturing challenges, optimize BOM costs, improve DFM/DFA, manage SKU customization, and perform root-cause analysis of field/RMA issues. Provides hands-on support for live and remote debugging across geographies while driving continuous process improvements.Accomplished in project planning, stakeholder management, and team leadership. Skilled in proposal development, vendor communication, Agile execution, JIRA-based tracking, effort/NRE estimation, milestone alignment, and process optimization. Known for clear communication, collaborative leadership, and creative problem-solving, consistently enabling teams to deliver high-quality embedded hardware that meets market and business objectives.
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