Jason Pauly
Semiconductor Packaging Engineer at Texas Instruments
- Role
- Semiconductor Packaging Engineer at Texas Instruments
- Location
- Dallas, TX, US
- LinkedIn followers
- 500 followers
About Jason Pauly
Engineering leader with 3 years of experience at Texas Instruments bridging the gap between R&D and high-volume manufacturing. Expert in thermal management, heterogeneous integration, and reliability physics for advanced electronic systems. Proven track record of leading cross-functional teams to solve industry crises, complex integration challenges, and deliver automotive-grade products on aggressive timelines.
Experience
Semiconductor Packaging Engineer
Feb 2023 — Present · Dallas, TX, US
Leading the company-wide response for an industry-wide glass fiber shortage, coordinating cross-functional teams and multi-tier suppliers to preserve substrate supply and maintain business continuity.Resolved a critical customer line-down by rapidly acquiring process expertise and directed cross-functional FA, quality, and operations teams to root cause and corrective action, restoring production in 2.5 weeks after 8 months and 100+ failed DOEs.Supported new product introductions and qualified multiple global assembly sites for both leaded and substrate-based packages, conducting feasibility, risk, tooling, cost, reliability, and manufacturability assessments to ensure production readiness, delivery continuity, and revenue ramp.
Education
Cockrell School of Engineering, The University of Texas at Austin
Bachelor of Science - Honors Mechanical Engineering, 4.0/4.0, Mechanical Engineering - Focus in Nuclear and Radiation Engineering
2019 — 2022
Clear Lake High School
High School Diploma, 5.66/4.0
2015 — 2019
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