Kay Jarchoff
R & d Engineer - Assembly Technology @Siemens
Berlin, DE
EMAILS
MOBILE NUMBERS
+91 *********19
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WORK HISTORY
Feb 2017 — Present
R & d Engineer - Assembly Technology @Siemens
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EDUCATION
2007 — 2010
Beuth University of Applied Sciences
Bachelor of Engineering (B.Eng.), Communication and Electronic Engineering
1993 — 1997
Siemens Professional Education
Electronics Installer - Systems Engineering
2010 — 2012
Beuth University of Applied Sciences
Master of Engineering (M.Eng.), Communication and Information Engineering
2002 — 2004
Siemens Professional Education
Microtechnologist, [MST] Micro Systems Technologies
SKILLS
Product ManagementElektronikAdhesive BondingFertigungReworkEngineeringR&DThermographyProduktmanagementLean ManagementIngenieurwissenschaftenPreparationForschung Und EntwicklungElectrical EngineeringWire BondingProjektmanagementSchlanke ProduktionAutomatisierungProject ManagementSoftwaretestsManufacturingSolderingElectronics PackagingElektrotechnikSmtWirtschaftsingenieurwesenFmeaProduktentwicklung
ABOUT KAY JARCHOFF
R&D Engineer - Assembly Technology @Siemens AG
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