Jamey Gigliotti

About Jamey Gigliotti

Strategic Engineering Leader | Scaling Advanced Packaging & Epitaxial Thin Film Solutions | R&D to HVMI bridge the gap between complex materials physics and commercial-scale manufacturability. With over 8 years of leadership at Intel, I specialize in transitioning novel thin-film and advanced packaging technologies from the lab to high-volume production (HVM). I thrive in high-stakes environments where hardware scaling and system reliability are the primary drivers of business value.Core Impact at Intel:Scaling Operations: Directed fab startup activities that increased capacity by 300% in <12 months, managing $40M in capital assets and a 20-person engineering team.Strategic Efficiency: Delivered a 22% reduction in unit wafer cost and realized $200M+ in operational savings through automation and process optimization.Reliability & Quality: Expert in driving System-Level Reliability (RAM) and 8D Quality Systems for foundational hardware, ensuring zero-defect delivery for global foundry customers.Technical Foundation:My leadership is built on a PhD in Materials Science (Georgia Tech) and a deep expertise in Functional Thin-Films, Epitaxial Growth, and Advanced Packaging systems. I have a proven track record of diagnosing complex failure physics in 3D architectures and translating high-level business goals into actionable engineering roadmaps.Key Expertise: Leadership: Org Design, P&L Management, Multi-site Tech Transfer, Vendor Negotiations. Engineering: Advanced Packaging, Epitaxy, ALD/CVD, Yield Improvement, Hardware Development. Operations: Fab Startup, FMECA/RAM Analysis, SPC, ISO/Automotive Quality Standards.I am passionate about future Advanced Packaging, Semiconductor Architecture, and Quantum Computing technologies. Let’s connect to discuss engineering leadership, quantum hardware, or semiconductor operations.

Experience

1. Engineering Manager - Advanced Packaging

   Intel

   Aug 2024 — Present · Albuquerque, NM, US

   Strategic Growth & Fab Startup: Directed high-stakes startup activities to scale wafer capacity by 300% in <12 months. Engineered a 50% reduction in technician work content through automation and process simplification, enabling rapid organizational scaling.Organizational Design & Leadership: Built and led a 20-person multi-disciplinary engineering organization. Restructured teams into specialized \"toolset squads\" to provide 24/7 factory support for foundry customers, doubling headcount and operational capability within one quarter.Asset & Capital Management: Managed a $40M+ capital asset portfolio. Spearheaded a department-wide cost-reduction initiative that delivered a 22% reduction in unit wafer cost.Cross-Functional Governance: Established and chaired strategic forums with Process Integration and Yield departments to align on technology development roadmaps, tool matching, and high-reliability standards for external foundry clients.Crisis & Change Leadership: Navigated complex business cycles by managing headcount through strategic layoffs and reshuffling, prioritizing core competencies and culture preservation while maintaining 100% mission readiness.Quality & Vendor Strategy: Drove vendor accountability for development timelines and negotiated commercial contracts. Implemented 8D quality systems to ensure zero-defect delivery for top-tier foundry partners.

Education

• Penn State University

  Bachelor's Degree, Materials Science and Engineering--Ceramics

  2009 — 2013

• Central Dauphin High School

  High School

  2006 — 2009

• National University of Singapore

  Engineering Design

  2010 — 2010

• Georgia Institute of Technology

  Doctor of Philosophy (Ph.D.), Materials Science and Engineering

  2013 — 2017

• Capital Area School for the Arts

  Film and Video

  2008 — 2009

Skills

• Atomic Layer Deposition
• Cvd
• Solution Preparation
• Mocvd
• Thin Films
• Tem
• Afm
• Characterization
• Scanning Electron Microscopy
• Surface Chemistry
• Nanofabrication
• X-Ray Crystallography
• Semiconductors
• Mems
• Matlab
• Fib
• Materials Science
• Sputter Deposition
• Sem
• Focused Ion Beam (Fib)
• Solidworks
• Piezoelectric
• Nanomaterials
• Nems
• Reactive Ion Etching
• Nanotechnology
• Analytical Skills
• Photolithography
• Sensors
• Ultrasound
• Pecvd
• Data Analysis
• Microfabrication
• Xps