James Jiangbo Tian.
Power Electronics scientist/Technical Fellow-SiC/IGBT/GaN/GDU/CB-EV EDU system-Power module/Gate driver/Motor control technique roadmap/benchmarking, IC packaging, PIM in-house design.
- Role
- Sr Analog Power Engineer at Methode Electronics
- Location
- Royal Oak, MI, US
- LinkedIn followers
- 500 followers
About James Jiangbo Tian.
Power Electronics engineer lead with demonstrated history of working in Automotive and Aerospace industries. Expertise in Silicon and WBG semiconductor power module (SiC/GaN/IGBT) characteristics and applications. Professional at Analog-digital hybrid high speed circuit design. Expertise in high power-density, highly-integrated, low profile and light design (Multichip, SoC, SiP, LTCC). Skilled in device/board/system level hardware design, FEA simulation and FPGA/MCU/DSP programming. Familiar with semiconductor manufacturing, Die level Micro-Assembly, SMT and IC packaging process. Experienced in Failure Mode and Effects Analysis (FMEA), Engineering Management, Production Part Approval Process (PPAP), Automotive and Radio Frequency (RF) Engineering. Proven strength in project management, new facility launches, business development, manufacturing management, negotiation and cross-functional global team management.
Experience
Sr Analog Power Engineer
Aug 2025 — Present · MI, US
Power electronics scientist on WBG based power switches characteristics and applications in automotive and indutrial area.
Education
Beijing Institute of Technology
Master of Science - MS, Microwave and electromagnetic field
Beijing Institute of Technology
Bechelor of Science - BS, Electrical and Electronics Engineering
Beijing Institute of Technology
Master’s Degree, Electrical and Electronics Engineering
2005 — 2007
University of Windsor
Doctor of Philosophy (Ph.D.), Power Electronics, Electric-Motor Drive
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