Jaena Joyce Cabanilla
Packaging R&D Engineer at Intel Corporation
- Role
- R & d Module Development Engineer at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
Experience
R & d Module Development Engineer
Aug 2023 — Present · Hillsboro, OR, US
Education
Portland State University
Graduate Certificate, Semiconductor Materials and Manufacturing
Seattle Central College
Associate of Science - AS, Engineering
2014 — 2015
Portland State University
Master of Science - MS, Materials Science and Engineering
2019 — 2022
University of Washington Materials Science & Engineering
Bachelor of Science - BS, Materials Science and Engineering
2015 — 2017
University of the Philippines
Materials Engineering
2010 — 2013
Find verified contacts for anyone on LinkedIn
Unifers gives sales teams verified emails and direct dials, enriched profiles, and outreach that lands in the inbox.
Free plan included · No credit card required
This profile is compiled from publicly available professional sources. Unifers is not affiliated with or endorsed by LinkedIn. Request removal of this profile.