Jaekyu Song
Principal Engineer @高通
San Diego, CA, US
EMAILS
j••••••••@qualcomm.com
MOBILE NUMBERS
+12•••••••47
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WORK HISTORY
Sep 2022 — Present
Principal Engineer @高通
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Expertises - Advanced IC package engineering- 3DIC Packaging.
SKILLS
MaterialsJmpProcess SimulationReliabilityCost ReductionPvdSpcFmeaDoeProduct EngineeringProcess DevelopmentSemiconductorsEtchingCharacterizationMemsCvdEngineering ManagementMaterials DevelopmentProgram ManagementTechnology DevelopmentMaterials ScienceElectronics PackagingDesign of ExperimentsFailure AnalysisProcess IntegrationElectronicsMicroelectronicsR&DProduct DevelopmentIcProcess EngineeringSemiconductor IndustryYieldManufacturing
ABOUT JAEKYU SONG
Proven ability in advanced IC package development and experience in transferring from R&D…
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