Jack Yukun Gong
Process Engineer @Lam Research
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WORK HISTORY
Process Engineer @Lam Research
Tualatin, OR, US
Led customer escalation efforts on optimization of BEOL gap fill in semiconductor manufacturing- Supported continuous improvement projects on Sabre electroplating tool development while collaborating in a matrix organization- Operated electroplating tool and various metrology tools proficiently in a cleanroom environment, showcasing expertise in data collection and analysis- Screened various copper electroplating chemistries/conditions and investigated additive mechanisms by performing benchtop coupon-plating tests- Held strong ownership and exemplified agility and open communication in executing customer demos and supporting customer escalations while protecting customer IP/materials
EDUCATION
Rose-Hulman Institute of Technology
Bachelor's Degree, Chemical Engineering
Case Western Reserve University
Doctor of Philosophy - PhD, Chemical Engineering
SKILLS
ABOUT JACK YUKUN GONG
Electrochemical etching/deposition scientist with 5+ years of experience in research and development specializing in novel electrochemical atomic layer etching (e-ALE), deposition (e-ALD), and electroless deposition (ELD) process for applications in semiconductor interconnect metallization and thin-film fabrication- Expertise in engineering and mechanistic aspects of thin-film processing, and knowledge of fundamental principles of electrochemistry and electroanalytical techniques- Good communicator with a positive attitude who works well with colleagues and collaboratorsTechnical Competencies—Research: Electroplating, wet etching, electroless deposition, electroanalytical studies using potentiostats, rotating disk electrode (RDE), quartz crystal microbalance (QCM), atomic force microscopy (AFM), X-ray fluorescence (XRF)Software: Microsoft Office, Origin, ImageJ, COMSOL Multiphysics, VersaStudio, EC-Lab, MATLAB, Maple, Aspen Plus, MS Visio, Minitab, Solid Edge (3D CAD)
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