Siva Priya Jaccani

About Siva Priya Jaccani

About me:Hello! I\'m a process engineer, materials scientist, researcher, published scientific author, and problem solver with a successful track record of pushing the boundaries of scientific knowledge and driving multimillion-dollar process development projects to completion by identifying and implementing data-driven solutions and by creating a strong shared synergistic, collaborative vision of success.Skills:• Materials Science, Materials Engineering, Materials Synthesis and Fabrication, Materials Characterization (Raman Spectroscopy, Brillouin Light Scattering (BLS), Vickers Indentation, Atomic Force Microscopy (AFM), Differential Thermal Analysis (DTA), Dilatometry, X-Ray Diffraction (XRD), Scanning Electron Microscopy (SEM), Energy Dispersive Spectroscopy (EDS), Transmission Electron Microscopy (TEM)), Structure-Property Relationships, Materials under Extreme Conditions• Manufacturing, Process Engineering, Statistical Process Control (SPC), Fault Detection & Classification (FDC), Root Cause Analysis (RCA), Corrective and Preventive Actions (CAPA), Failure Mode and Effects Analysis (FMEA), Standard Operating Procedure (SOP) Documentation, Process Development, Technology Development (TD), Data Analysis, Statistical Analysis, JMP, Design of Experiments (DOE), Continuous Improvement Process (CIP), Cost Analysis, Process Change Documentation, Process Transfer• Technical Writing, Technical Manuscript Reviewing, Critical Thinking, Problem Solving, Decision Making, Workload Prioritization and OrganizationLet’s connect:I’m eager to connect with professionals in process engineering, materials science, glass science or related fields. Whether it\'s to exchange ideas, explore industry trends, or grow our networks, I look forward to connecting and fostering meaningful professional relationships.

Experience

1. Process Technology Development Engineer

   Intel

   Jul 2018 — Present · Hillsboro, OR, US

   Senior Engineer: Jul’18 to March’22, Staff Engineer: April’22 to Present Driving integrated process development and sustaining efforts across multiple process technology nodes in the test wafer regeneration area which includes wet etch, wet clean, and CMP process modules, collaborating with 15 engineers and 40 technicians. • Qualified and transferred first-of-a-kind (FoK) wet etch equipment platforms to global factories, developing robust process definitions and leveraging new equipment capabilities for optimal performance.• Developed and implemented optimized rinse processes ahead of schedule across multiple wet bench platforms. This led to improved defect quality, 38% water savings, 20% higher equipment output,$25 million in capital equipment savings, and $1.97 million in annual cost savings, advancing Intel’s 2030 RISE Sustainability goals.• Conceptualized, critically tested, and implemented a unique process, merging 5 process contamination modes into 1, improving effective tool output by ~80%, saving ~32% in chemical costs, and enabling effective utilization of first-of-a-kind (FoK) equipment with 20% smaller fab footprint. • Identified constraints to wet bench output, analyzed critical equipment bottlenecks, drove solutions that improved cascading, batching, buffer utilization, and increased tool run-rate by 51%.• Led the selection, testing, and qualification of new filters for a wet clean process, achieving a 15% improvement in defects.

Education

• Rensselaer Polytechnic Institute

  Doctor of Philosophy (PhD)

  2013 — 2018

• Indian Institute of Technology, Madras

  Bachelor of Technology (B.Tech)

  2009 — 2013

Skills

• Raman Spectroscopy
• Materials Science
• Electron Microscopy
• Research
• Differential Thermal Analysis
• Atomic Force Microscopy
• X-Ray Diffraction
• Brillouin Spectroscopy
• Glass
• Optical Microscopy