Izzat Muhaimin Madisa
Advanced Packaging Process Engineer at Intel Corporation
- Role
- Advanced Packaging Process Engineer at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
About Izzat Muhaimin Madisa
Experienced Production|Quality|Maintenance Engineer and CePIETSO Competent Person with a demonstrated history of working in the manufacturing industry locally and oversea. Experienced to be service provider as well as inspector and technical adviser in various projects involving project management, installation, design, technical evaluation, maintenance as well as site visit inspection. Strong engineering professional with a Master’s Degree focused in Industrial Engineering from University of Technology Malaysia.
Experience
Advanced Packaging Process Engineer
Apr 2022 — Present · Aloha, OR, US
Education
Universiti Teknologi Malaysia
Master of Science - MS, Industrial Engineering
2015 — 2018
Seoul National University
Certificate, Intensive Korean Language and Culture Course
2008 — 2009
Dongyang Mirae University
Diploma, Mechanical Engineering
2009 — 2011
Sekolah Menengah Sultan Abdul Halim
Sijil Pelajaran Malaysia, Science Stream
Korea University
Bachelor of Science (B.Sc.), Mechanical Engineering
2011 — 2013
Skills
- Autocad
- Cad
- Ugs Nx5
- Mechanical Engineering
- Powerpoint
- Microsoft Excel
- Microsoft Word
- Project Engineering
- Engineering
- Pro Engineer
- Microsoft Office
- English
- Project Management
- Inventor
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