Indrajit Paul
Package Concepts Development be @STMicroelectronics
Munich, DE
EMAILS
MOBILE NUMBERS
+91 *********19
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WORK HISTORY
Feb 2023 — Present
Package Concepts Development be @STMicroelectronics
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Munich, DE
EDUCATION
2002 — 2004
Indian Institute of Science (IISc)
Master of Technology (M.Tech.), Instrumentation
1998 — 2002
Netaji Subhas Institute of Technology
Bachelor of Engineering (B.E.), Instrumentation and control
SKILLS
Finite Element AnalysisNanotechnologyTolerance AnalysisElectro-Mechanical DesignCharacterizationProblem SolvingSimulationsCoaching & MentoringEngineeringThin FilmsProduct DevelopmentSemiconductor PackagingSix SigmaSemiconductorsMechanical EngineeringMatlabMaterials ScienceR&D
ABOUT INDRAJIT PAUL
Power module packaging engineer
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