Ibrahim Misbah
PhD | Packaging R&D Engineer at Intel Corporation
- Role
- Packaging Research & Development Engineer at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
About Ibrahim Misbah
Currently, working as Packaging R&D Engineer at Intel Corporation. The work primarily…
Experience
Packaging Research & Development Engineer
Oct 2021 — Present · Hillsboro, OR, US
Education
Scholar's School and College
Secondary School Cerificate, General Science
2003 — 2008
University of Dhaka
B.Sc, Applied Physics,Electronics and Communication Engineering
2009 — 2014
University of Houston
Doctor of Philosophy - PhD, Electrical and Electronics Engineering
2016 — 2020
University of Dhaka
M.Sc Engg, Electrical and Electronics Engineering
2015 — 2016
Notre Dame College
Higher Secondary, Science
2007 — 2009
Maple Leaf International School
Primary School Certificate, Elementary Education and Teaching
1998 — 2003
Skills
- Matlab
- Ion Milling
- Uv/Vis Spectroscopy
- C++
- Pspice
- Programming
- Microsoft Office
- Scanning Electron Microscopy
- Microsoft Word
- E-Beam
- Spin Coating
- Sputter Deposition
- Powerpoint
- Profilometer
- Electronics
- Engineering
- Photolithography
- Research
- Java
- Reactive Ion Etching
- C
- Raman Spectroscopy
- Microsoft Excel
- Autocad
- Teamwork
- Microsoft Powerpoint
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