Hyun Paik

Principal Engineer at Qualcomm

Role
Principal Engineer at Qualcomm
Location
San Jose, CA, US
LinkedIn followers
500 followers

About Hyun Paik

18 years of IT engineering hands-on working professional in the fieldCurrently working (15 years) in Core BSP Apps team in Qualcomm and supports various customer projects that use QCT Snapdragon/Gobi processors to be implemented and launched in the market including smart phone, IoT and vehicles. Strong background in software design for embedded systems, experience spans from conceptualization to design, code, integration, test and product launch.Special experience on leading IoT products on planning/designing/development for government-funding national defense projects. The enterprise mindset achieved in the start-up company in Silicon Valley.Summa cum laude in college for both majors: Electrical Engineering and Business

Experience

  1. Principal Engineer

    Qualcomm

    Jan 2009 — Present · Santa Clara, CA, US

    As a Core BSP engineer in the QCT (Qualcomm CDMA Technology) division, design and develop common software integration, ARM architecture system stability, interface and architecture such as PCIe, High speed USB, HSIC, SSIC, SPI/SDIO/I2C bus controls on various OS platform including Android, Windows Mobile and iOS(Processors experienced: state-of-the-art all QC chip sets such as QSC 6270, MSM6246/6290, 6800, 7200,7200A, 7230, 8250/8650, MDM9K/9x15/9x25/9x35/9x45/9x55/9x65/SMD845/SMD855 and Snapdragon series) • Leading and supporting customer projects for applying QCT chipsets to customer platform from the bringup and all entire product cycle support. • Specialties on core stability and Inter-Process communication (IPC) implemented by PCIe, HSIC/SSIC. Core BSP and stability on ARM architecture. Application processor integration with Qualcomm Modem• Linux Kernel debugging

Education

  • Stanford University

    MS, Electrical Engineering

    2004 — 2006

Skills

  • Mobile Devices
  • Lte
  • C
  • Embedded Systems
  • Matlab
  • Project Management
  • Integration
  • Systems Engineering
  • C++
  • Software Engineering
  • Telecommunications
  • Python
  • Java
  • Linux
  • Mplab
  • Microchip Pic
  • Ti Dsps
  • Trace32
  • Nand Flash
  • Arm Cortex-M
  • Linux Kernel
  • Vxworks
  • U-Velocity
  • L4/Rex
  • Spi
  • I2c
  • Motorola Power Pc
  • Uart
  • Ssic
  • Hsic
  • Pcie
  • Tcp/Ip
  • Udp
  • Arm
  • X86 Assembly
  • Visual C#
  • Intel 8051
  • Android Development
  • Ios Development
  • Algorithms

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