Hussein Darir
PhD | Research and Development Engineer
- Role
- Packaging R & d Engineer at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
About Hussein Darir
A self-motivated PhD graduate from the University of Illinois at Urbana-Champaign with…
Experience
Packaging R & d Engineer
Sep 2023 — Present · Hillsboro, OR, US
Advanced packaging process development.
Education
University of Illinois at Urbana-Champaign
Master's degree
2017 — 2019
University of Illinois Urbana-Champaign
Doctor of Philosophy - PhD
2019 — 2022
Lycée Franco-Libanais Verdun
French baccalaureate
American University of Beirut
Bachelor's degree
2013 — 2017
Skills
- Engineering
- Project Planning
- Microsoft Word
- Matlab
- C++
- Mechanical Engineering
- Autocad
- Microsoft Office
- Project Management
- Control Systems Design
- Powerpoint
- Research
- Leadership
- Programming
- Labview
- English
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