Hung-Yun Lin
- Role
- Packaging Engineer, Mgts at Texas Instruments
- Location
- Dallas, TX, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
Experience
Packaging Engineer, Mgts
Feb 2020 — Present
Skills
- Material Characterization
- Abaqus
- Simulations
- Mathematica
- Matlab
- Numerical Analysis
- Heat Transfer
- Labview
- Ansys
- Fracture Mechanics
- Finite Element Analysis
- Nano-Indentation
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