Hsien-Lien Huang

Engineer | Semiconductor Failure Analysis | TEM/FIB & Automation

Role
Tem Engineer at Samsung Semiconductor
Location
Austin, TX, US
LinkedIn followers
500 followers

About Hsien-Lien Huang

TEM Engineer with experience in electron microscopy, semiconductor failure analysis, and workflow automation. Focused on developing FIB/TEM-based analysis workflows and applying machine learning techniques to improve efficiency and consistency in microscopy data processing.Interested in bridging physical analysis with data-driven methods to support better understanding of semiconductor structures and defects.

Experience

  1. Tem Engineer

    Samsung Semiconductor

    Aug 2023 — Present · Austin, TX, US

    Developed automation workflows for TEM/FIB-based failure analysis• Built tools for TEM request generation, including sample parsing and grouping• Applied machine learning techniques for microscopy image analysis• Processed TEM/FIB imaging data for analysis and interpretation

Education

  • National Chung Hsing University

    Bachelor of Science (B.Sc.), Chemical Engineering

    2008 — 2012

  • Cornell University

    Master of Engineering (M.Eng.), Chemical Engineering

    2015 — 2016

  • The Ohio State University

    Doctor of Philosophy - PhD, Materials Science and Engineering

    2018 — 2023

  • Cornell University

    Master of Science (MSc), Chemical Engineering

    2016 — 2018

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Hsien-Lien Huang — Tem Engineer at Samsung Semiconductor in Austin, TX, US | Unifers