Hualiang Shi

About Hualiang Shi

Two decades of comprehensive product development experience has equipped me with a broad range of skills, encompassing architecture selection, design optimization, material/process/tool refinement, system integration, and rigorous qualification. With proven expertise spanning multiple levels – from materials to components, boards, modules, and systems – I have developed a unique understanding of various industries, including semiconductor, camera, display, consumer electronics, and automotive. Demonstrated proficiency in developing fabrication and packaging processes, along with designing product and test vehicles (TVs). Proven expertise in standard-based qualification (SBQ), knowledge-based qualification (KBQ), silicon/package failure mechanisms, and diverse reliability testing methodologies. Proven experience in developing software toolkits to enhance manufacturing efficiency and product reliability, with expertise in commonality analysis, yield optimization using data-driven dashboards, and statistical reliability analysis. Proven ability to drive project success through effective issue tracking and project management, utilizing various quality tools and structured problem-solving methodologies to identify, prioritize, and resolve complex challenges. Self-motivated and results-oriented professional who excels at working independently, demonstrates strong communication and interpersonal skills, fosters collaboration within cross-functional teams, and consistently delivers exceptional results with a strong customer focus. Extensive professional network in the semiconductor industry, featuring key relationships with OSATs, fab foundries, and other industry stakeholders.

Experience

1. Chair

   Ieee Electronics Packaging Society Eps - Silicon Valley Area Chapter

   Jan 2025 — Present · CA, US

   Volunteer to generate interest to benefit the community through education, networking, professional development by participation in seminars and webinars in the exciting and rapidly advancing field of electronic packaging technology.

Education

• The University of Texas at Austin

  Ph.D, Semiconductor

  2003 — 2010

• University of Science and Technology of China

  BS, Physics

  1998 — 2003

Skills

• Cvd
• Plasma Physics
• Ellipsometry
• Process Integration
• Nanotechnology
• Pecvd
• Materials
• Ftir
• Vacuum
• Microscopy
• Characterization
• Xps
• Afm
• Labview
• Device Characterization
• Matlab
• Sputtering
• Photolithography
• Chemistry
• Semiconductors
• Thin Films
• Fib
• Solid State Physics