Hsin Chang Liao

About Hsin Chang Liao

More than 20 years of expertise working in semiconductor and optical engineering operations within the high-volume semiconductor manufacturing sector. A dedicated and dynamic professional who is well-versed in collaborating cross-functionally with internal teams, and in routinely meeting SLAs and exceeding customer expectations. Skilled in employing methodologies and best practices to continuously streamline and improve processes.

Experience

1. Lead Electrical Engineer

   L3Harris Technologies

   Jun 2023 — Present · Palm Bay, FL, US

   1.Strong Knowledge in wafer bonding process optimization and depth understanding of fusion, hybrid and direct bonding technologies.2. Preform design of experiment (DOE) to improve bond strength, eliminate bond voids, maximize bonding strength and qualifies wafer bonding process on new tool.3.Knowledge of monitors bonding metrics to account for process drift and perform root cause corrective analysis (RCCA) and wafer bonding process by responding to in-line issues and dispositions of production wafers.4.Knowledge with corrective wafer qualifies factor like thermal oxide deposition, wafer bow compensation, wafer surface roughness (AFM) and wafer level bonding tool process flow development.5.Knowledge with Software Data Analysis software (Minitab, JMP, etc.)6.Knowledge with multiple different layer material assembly process flow development

Education

• Chung Yuan Christian University

  Master's degree, Chemistry

  2003 — 2005

• Chung Yuan Christian University

  Bachelor's degree, Chemistry

  1999 — 2003

Skills

• Characterization
• Optics
• Soc
• Lamination Lithography Package Assembly
• Silicon
• Mems
• Ic
• Materials
• Lithography
• Analog
• Yield
• Design of Experiments
• Testing
• Fpga
• Asic
• Thin Films
• R&D
• Embedded Systems
• Product Engineering
• Mixed Signal
• Jmp