Hoang-Hai Phan
Staff Engineer @Qualcomm
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WORK HISTORY
Staff Engineer @Qualcomm
Munich, DE
At Qualcomm, I have a great chance to work with great colleagues globally on developing wafer-level-packaging technology for RF front-end filters. I contribute to projects with my expertise in FEA for mechanical reliability and layout design rules:My first main responsibility is creating design rule documents for global SAW design, ensuring mass production quality. This is an exciting experience working with process engineers on process capability then condensing those knowledge into clear guidelines for global RF designers.My second main responsibility is to lead FEAs on reliability issues for new packaging technologies, enabling earlier and more precise decisions on design and materials. On this front, it is challenging but particularly fun using FEM and other statistics tool to make prediction about package reliability.
EDUCATION
High School for Gifted Students, Hanoi University of Science, Vietnam National University
High School Diploma, Physics
Hanoi University of Science and Technology
Bachelor of Engineering (B.E.), Mechatronics, Robotics, and Automation Engineering
Hanoi-Amsterdam High School for the Gifted
Middle School Diploma
The University of Freiburg
Master of Engineering (M.Eng.), Microsystems Engineering
SKILLS
ABOUT HOANG-HAI PHAN
2012: Began professional journey with an internship at a major mobile internet company in Guangzhou, China, during the rise of affordable smartphones in Asia. Aspired to contribute to engineering transformative devices.2014: Enrolled in the Microsystem Engineering Master\'s program at IMTEK, focusing on semiconductor technology and fabrication. Participated in prototype development for two startups:muVaP GmbH: Specializing in micropump technologies.Phaseform: Specializing in adaptive optics.2017: Completed Master\'s degree and joined Qualcomm RF360:Focused on advancing technology in wafer-level-packaging of Surface Acoustic Wave (SAW) filters.Developed expertise in mechanical reliability, process development and material research.Current Ambitions: Continues to be contribute to advancing technologies in the semiconductor industry.
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