Hongyi Mu

About Hongyi Mu

Professional experience:26+ years of semiconductor industry experience in making IC chips. Proficient in CVD/PVD/Photo process characteristics and equipment maintenance/troubleshooting.Objective: Seeking chanllenging project management position in semiconductor equpment/process engineering to improve equipment up time and productivitySpecialties: ASML Twinscan, Yieldstar, AMAT/Novellus/WJ CVD and AMAT PVD, SUN Unix OS, AutoCAD

Experience

1. Customer Service Engineer

   ASML

   Apr 2007 — Present

   Two years extensive hands-on experience providing applications support for exposure tools in an advanced 300 mm wafer fab.#. Worked with the customer to solve imaging and overlay issues and to support their development activities.#. Guide customers through experimentation to ensure that they are performed in an efficient and accurate manner.#. Help diagnose customer problems and generate list of tasks needed for solutions.#. Identify techniques for customers to use to maximize the performance and use of ASML products.#. Conduct data analysis to ensure that the correct conclusions are drawn from the experimental data that the customers acquire. Report results to ASML.#. Receive trainings on optical theory, scanner tool performance and optimization and photoresist processing.(ASML Apps Level I and II training in Tempe AZ,20••••08)Skills:Skilled at operating and basic troubleshooting of ASML scanners, CD-SEM and Yieldstar metrology tools, and optical lithographic simulation tools like ASML Lithocruiser 3.0 ( basic process setup, Mask Editor, CD analyzer, Batch Optimization, OPC etc.)

Education

• Xidian University

  BS, Electro-Mechanics

  1991 — 1995

• Stevens Institute of Technology

  Master, Materials Engineering

  2005 — 2007

Skills

• Lithography
• Autocad
• Lean Manufacturing